Unprimed Adhesive Solution Delivers More Uniform Bonds
Electronics grade alkoxy sealants outperform slower materials in multi-step assembly applications where the fast tack and early strength are needed as a unit moves from station to station. They often replace riveting and bolting in sealing and bonding applications. When a non-corrosive product is required, this is an alternate unprimed adhesive solution that:
- Delivers a more uniform bond
- Acts like a gasket to protect against moisture and dust
- Helps dampen vibrations
These moisture-cure conformal coatings and sealants achieve primer-less adhesion to aluminum, polycarbonate, glass, and steel. The inside-out cure provides longer working times and low odor, and are free of solvents with no isocyanates.
Electronics-grade alkoxy silicones are available in a range of viscosities, all delivering fast tack-free times.
Low-medium viscosity – When flow coating is preferable to paste-consistency products, these will flow into small crevices and other hard to reach places.
High viscosity – These can be applied on vertical surfaces with no sagging, and have superior gap-filling properties that perform well in hostile environmental conditions.
- Frame and junction box sealant in photovoltaic modules
- Sensitive electronic components and circuit boards
- Thin-section encapsulation
*The values outlined reflect testing that was conducted under laboratory conditions, actual results may vary. The information provided in the above table is not intended for use in preparing specifications. Please consult manufacturer for additional information.