Unprimed Adhesive Solution Delivers More Uniform Bonds

Electronics grade alkoxy sealants outperform slower materials in multi-step assembly applications where the fast tack and early strength are needed as a unit moves from station to station. They often replace riveting and bolting in sealing and bonding applications. When a non-corrosive product is required, this is an alternate unprimed adhesive solution that:

  • Delivers a more uniform bond
  • Acts like a gasket to protect against moisture and dust
  • Helps dampen vibrations

These moisture-cure conformal coatings and sealants achieve primer-less adhesion to aluminum, polycarbonate, glass, and steel. The inside-out cure provides longer working times and low odor, and are free of solvents with no isocyanates.

Electronics-grade alkoxy silicones are available in a range of viscosities, all delivering fast tack-free times.

Low-medium viscosity – When flow coating is preferable to paste-consistency products, these will flow into small crevices and other hard to reach places.

High viscosity – These can be applied on vertical surfaces with no sagging, and have superior gap-filling properties that perform well in hostile environmental conditions.

Applications

  • Frame and junction box sealant in photovoltaic modules
  • Sensitive electronic components and circuit boards
  • Thin-section encapsulation
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500-225500-257
Physical Properties
FormSprayable / FlowableSprayable / Flowable
Skin Over Time (minutes)10 - 30 min20 - 45 min
Through Cure (hours)48 maximum72
Viscosity (cPs)2,000 - 3,00035,000 - 40,000
Extrusion Rate (g/min)
Durometer (Shore A)13 +/- 510 +/- 5
Tensile Strength (psi)45 - 6550
Elongation (%)140 - 160450
Specific Gravity1.00 - 1.05 g/cc0.95 - 1.01 g/cc
Appearance (Mixed)Translucent LiquidTranslucent Liquid
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500-607
Before Cure
DescriptionPotting and Encapsulant
Appearance (After Mixing)Clear
Mix Ratio Base: Cure (By Volume)1:1
Specific Gravity Part A (Mixed, 25°C)0.95 - 1.05 g/cc
Specific Gravity Part B (Mixed, 25°C)0.95 - 1.05 g/cc
Viscosity Part A (Mixed, 25°C) (cPs)100 - 200 cPs
Viscosity Part B (Mixed, 25°C) (cPs)1,500 - 2,500 cPs
Gel Time (Mixed, 25°C)5 - 6 hours
After Cure
Service Temperature-40°C to 205°C (-40°F to 400°F)
Tensile Strength (ASTM D412)
Elongation (ASTM D412)
Shore A (ASTM D2240)13 - 18
Tear Resistance (ASTM D624)1.5 - 2.5 pli
Coefficient Of Linear Thermal Expansion
(ASTM E831)
6.67 x 10-4°C
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500-09x500-100500-150
Physical Properties
FormPastePastePaste
Skin Over Time (minutes)5 - 155 - 1510 - 30
Through Cure (hours)72 maximum72 maximum72 maximum
Viscosity (cPs)
Extrusion Rate (g/min)404030
Durometer (Shore A)35 +/- 525 +/- 518 +/- 5
Tensile Strength (psi)200 - 300150 - 200175 - 225
Elongation (%)325 - 425400 - 450950 - 1050
Specific Gravity1.30 - 1.40 g/cc1.20 - 1.30 g/cc1.00 - 1.05 g/cc
Appearance (Mixed)White or Black PasteWhite PasteTranslucent Paste
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*The values outlined reflect testing that was conducted under laboratory conditions, actual results may vary. The information provided in the above table is not intended for use in preparing specifications. Please consult manufacturer for additional information.

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