Electrical Potting and Encapsulation Silicones

For some production environments and below ground applications, the right compound for potting and encapsulation may be an addition cure gel system. These solvent-free systems (either 2-part or 1-part plus heat) cure to flexible elastomers with no corrosive byproducts. All have exceptionally fast cure times and convenient mix ratios along with excellent dielectric properties.

Applications

  • General potting and encapsulation
  • Junction box enclosures
  • Cable splice kits
  • Waterproof connectors
  • Sensors
  • Electrical insulation
  • Amplifiers
  • Relays
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600-160600-170600-180600-200600-205
Before Cure
DescriptionPotting and EncapsulantionPotting and EncapsulantionSilicone ElastomerSilicone GelSilicone Gel
Appearance (After Mixing)GrayBlackClearClearClear
Mix Ratio Base: Cure (By Volume)1:11:11:11:11:1
Specific Gravity Part A (Mixed, 25°C)1.55 - 1.701.35 - 1.450.95 - 1.100.95 - 1.050.95 - 1.05
Specific Gravity Part B (Mixed, 25°C)1.55 - 1.701.35 - 1.450.95 - 1.100.95 - 1.05
Viscosity Part A (Mixed, 25°C) (cPs)25,000 - 30,000 cPs6,000 - 8,500 cPs15,000 - 20,000 cPs2,000 - 4,000 cPs3,000 - 5,000 cPs
Viscosity Part B (Mixed, 25°C) (cPs)10,000 - 14,000 cPs18,000 - 22,000 cPs2,500 - 3,500 cPs2,000 - 4,000 cPs3,000 - 5,000 cPs
Penetrometern/an/an/a4.0 - 4.3 mm4.0 - 5.0 mm
Working Time (min) (Mixed, 25°C)< 15 min< 15 min< 20 min< 15 min3 - 5 min
Cure Time (hours)2 - 3 hours2 - 3 hours15 - 30 min2 - 3 hours
After Cure (7 Days @ 25°C/50% RH)
Service Temperature- 40°C to 205°C (-40°F to 400°F)- 40°C to 205°C (-40°F to 400°F)- 40°C to 205°C (-40°F to 400°F)- 40°C to 205°C (-40°F to 400°F)- 40°C to 205°C (-40°F to 400°F)
Tensile Strength (psi) (ASTM D412)600 - 800 psi400 - 700 psi850 - 1,150 psi
Elongation (%) (ASTM D412)100 - 150%100 - 300%240 - 400%
Shore A (ASTM D2240)60 - 7045 - 6535 - 45
Tear Resistance (ASTM D624)15 - 25 pli15 - 25 pli20 pli
Flammability Class (UL-94)V0 (Pending)
Volume Resistivity (ASTM D257)16.7 x 1014 Ω · cm8.45 x 1013 Ω · cm9.47 x 1014 Ω · cm
Dissipation Factor
[100 Hz/100 kHz]
(ASTM D150)
0.0034/ 0.00280.0020/ 0.00170.0025/ 0.0022
Dielectric Constant
[100 Hz/100 kHz]
(ASTM D150)
3.39/3.40 3.69/3.713.39/3.41
Dielectric Strength
[10 mil gap]
(ASTM D149)
400 v/mil470 v/mil534 v/mil
Adhesion
(ASTM D903, 7 days @ 50% RH & 75°F)
Glass
PVC
Wood
UL RatingUL 94 V0 PendingUL 94 V0 PendingUL 94 V0 Pending
Downloads
TDS DownloadDownloadDownloadDownloadDownloadDownload
SDS A Download-DownloadDownloadDownloadDownload
SDS B Download-DownloadDownloadDownloadDownload
Sell SheetDownloadDownloadDownloadDownloadDownload
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*The values outlined reflect testing that was conducted under laboratory conditions, actual results may vary. The information provided in the above table is not intended for use in preparing specifications. Please consult manufacturer for additional information.

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