Addition Cure Silicones
Electrical Potting and Encapsulation Silicones
For some production environments and below ground applications, the right compound for potting and encapsulation may be an addition cure gel system. These solvent-free systems (either 2-part or 1-part plus heat) cure to flexible elastomers with no corrosive byproducts. All have exceptionally fast cure times and convenient mix ratios along with excellent dielectric properties.
- General potting and encapsulation
- Junction box enclosures
- Cable splice kits
- Waterproof connectors
- Electrical insulation