Addition Cure Silicones

Electrical Potting and Encapsulation Silicones

For some production environments and below ground applications, the right compound for potting and encapsulation may be an addition cure gel system. These solvent-free systems (either 2-part or 1-part plus heat) cure to flexible elastomers with no corrosive byproducts. All have exceptionally fast cure times and convenient mix ratios along with excellent dielectric properties.

Applications

  • General potting and encapsulation
  • Junction box enclosures
  • Cable splice kits
  • Waterproof connectors
  • Sensors
  • Electrical insulation
  • Amplifiers
  • Relays

Products

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*The values outlined reflect testing that was conducted under laboratory conditions, actual results may vary. The information provided in the above table is not intended for use in preparing specifications. Please consult manufacturer for additional information.